The University of Münster Goes Waterless with Two-Phase Liquid Cooling!

Like every other higher education and research institution in the world, The University of Münster needed more compute power. Still, it was challenged with how to provide this while controlling its heat, energy consumption, and floor space. This is where ZutaCore^®’s direct-to-chip, two-phase liquid cooling solution was a game changer! Compared to other liquid cooling solutions, HyperCool^® delivers the most computing power for the money, eliminates the risk of water leakage, and reduces the university’s energy costs.

To learn more about the University’s journey to waterless liquid cooling, click here to read a full case study that walks through the reasons they chose two-phase technology and the stellar results they are having now that the system is up and running. In fact, after the success of their first HyperCool deployment, the University plans to consider the technology for all future needs – opening a way to accommodate the skyrocketing power requirements of the urgently needed HPC resources in their limited data center real estate. They also plan to consider leveraging HyperCool’s unique heat re-use capabilities where the heat from processors can be used to heat some of the university rooms and buildings. As Jürgen Hölters, the University’s Deputy Head of CIT, pointed out “The possibilities to redirect that heat can deliver a significant environmental impact not only to the University, but to the planet itself as we strive globally for net zero emissions.”

HyperCool Continues to Go Mainstream

The University of Münster is just the latest organization to go “water-free” by leveraging ZutaCore’s two-phase liquid cooling technology. With dozens of HyperCool deployments in production, data centers, hyperscalers, and AI factories are rapidly moving to this technology because it enables them to harness the power of high-performing GPUs and CPUs in an environmentally friendly and sustainable way. Key features of the technology include:

• High Thermal Design Power (TDP) - Supports 2800W and above TDP in a compact, environmental-friendly, scalable design.
• 100% Heat Reuse - Provides constant and high output water temperature (70 ℃) and 30-40% less energy for heat reuse applications. 
• Superior Power Usage Effectiveness - Achieves as low as 1.04 PUE, delivering 10-20% better energy efficiency with dynamic cooling, smaller pumps, and no performance degradation over time.
• Higher Server Densification - Uses up to 50% less space in an air-assisted liquid cooled datacenter and up to 75% less space compared to immersion cooling.
• Zero Risk to IT Meltdown - Non-conductive heat transfer fluid ensures no damage and continuous operation in the unlikely event of a leak, compared to water-based technologies where leaks could cause significant server damage and outages.
• Lowest Maintenance - The quality and amount of the heat transfer fluid in HyperCool stay the same after many years of usage. Since no water is used, the system is free from corrosion and water-related threats such as mold.
• Ideal for Chiplet Architecture - The unique design automatically maintains different temperatures at different locations, which is key for AI servers leveraging the latest chipset architectures.

To learn more about HyperCool and how it drives the future of AI sustainability, download this eBook.