New Two-Phase Cold Plate Supports Reversed Orientation and Advanced Power Delivery Configurations — Live at OCP Global Summit
October 14, 2025, Foster City, CA – ZutaCore®, a leader in waterless direct-to-chip liquid cooling, today unveiled ZutaCore® OmniTherm™, a technology innovation that showcases the next evolution of two-phase cold plate design.
Engineered to address advanced use cases such as back-side power delivery, inverted orientation and non-standard server configurations, ZutaCore OmniTherm delivers multi-directional performance and redefines thermal flexibility for AI, HPC, and cloud infrastructure – especially in environments with high-density layouts or complex component geometries.
The solution will be demonstrated as a technology preview at the 2025 OCP Global Summit, October 13-16 in San Jose, CA, at the ZutaCore booth (C31) and Wiwynn booth (B13) - offering attendees a first look at the company’s vision for next-generation direct-to-chip cooling.
ZutaCore OmniTherm represents a breakthrough in waterless liquid cooling architecture. Built on ZutaCore’s patented two-phase, pool-boiling technology, it transfers heat directly at the chip surface with dramatically higher efficiency than traditional cold plates – and critically, it maintains performance in any mounting orientation, including vertical, horizontal, or fully inverted installations.
“As AI workloads surge, data center design paradigms are being rewritten. High‑ampacity in‑rack DC busbars—now integral to AI architectures—introduce new challenges to operators," said Alex Cordovil, Research Director at Dell’Oro Group. “These architectural shifts are accelerating demand for direct-to-chip liquid cooling solutions capable of managing not only extreme heat flux, but also providing the design flexibility required to support modular, orientation-agnostic system architectures.”
“ZutaCore OmniTherm, is a critical leap forward in thermal innovation,” said My D.Truong, CTO of ZutaCore. “It gives data centers and system designers the thermal flexibility to design and run tomorrow’s compute loads on today’s infrastructure – without the need to compromise.”
From Rack to Edge: What ZutaCore OmniTherm Delivers for the Data Center
- Any Orientation Deployment
Operates in vertical, horizontal, or inverted positions – ideal for edge, modular, blade, or high-density systems.
- Back-side power delivery cooling
Delivers thermal management not just for AI accelerators but also PCIe cards and bottom-mounted power delivery components, including two side cooling solutions.
- Drop-in Compatibility
Installs into existing server footprints without requiring mechanical redesigns or infrastructure changes, accelerating time-to-market
- Cross-Platform Versatility
Supports a unified cooling strategy across hyperscale, enterprise, and edge environments.
Built on ZutaCore’s Proven Waterless Platform
ZutaCore OmniTherm is built on the company’s flagship two-phase, waterless liquid cooling solution. It uses a non-conductive, non-corrosive dielectric fluid that instantly absorbs and removes heat at the chip level. This IT-safe design ensures worry-free operation even in the unlikely event of a leak.
About ZutaCore
Founded in 2016, ZutaCore is redefining sustainable cooling with ZutaCore® HyperCool®, a waterless, direct-to-chip liquid cooling technology built for the most demanding AI workloads. Capable of cooling the industry’s hottest processors while enabling 100% heat reuse, HyperCool empowers data centers to scale more safely, efficiently, and sustainably. Headquartered in Foster City, California, with global operations, ZutaCore is leading the charge toward net-zero, waterless data centers.
Learn more about HyperCool and its impact on AI data centers at zutacore.com.
ZutaCore Press Contact:
Alison Deane
Vice President, Marketing
marketing@zutacore.com
Copyright 2025. All rights reserved. ZutaCore and HyperCool are registered trademarks of ZutaCore, Inc.
Alison Deane : Jun 3, 2024 12:00:00 AM
Alison Deane