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ZutaCore Unveils Waterless End-of-Row CDU Family to Power the Next Generation of AI Data Centers

ZutaCore Unveils Waterless End-of-Row CDU Family to Power the Next Generation of AI Data Centers

New 1.2MW and 2MW cooling systems redefine efficiency, reliability, and sustainability for high-density, AI-scale infrastructure 

Foster City, CA - November 12,2025 ZutaCore®, a leader in waterless, direct-to-chip, two-phase liquid cooling today announced the launch of its Waterless End-of-Row (EOR) Coolant Distribution Unit (CDU) family, featuring 1.2MW and 2MW systems that deliver breakthrough performance and scalability for AI and high-performance computing (HPC) environments. 

As the AI revolution drives unprecedented compute density, ZutaCore’s new EOR CDU family provides a smarter, centralized approach to liquid cooling, supporting multiple racks from a single unit while maintaining rack-level monitoring and control. This innovative design reduces infrastructure duplication, lowers total cost of ownership, and enables true waterless operation inside the white space, addressing the dual challenge of performance and sustainability facing modern data centers. 

Watch the ZutaCore End-of-Row CDU Family in action: View the video here 

Using ZutaCore’s patented two-phase, direct-to-chip cooling technology and a low-GWP dielectric heat transfer fluid, the EOR CDU rejects aggregated heat into the facility, eliminating the risk of leaks or condensation. The result is higher thermal efficiency, lower energy use, and safer operation - even at the extreme power densities demanded by AI and HPC workloads. 

“AI data centers demand reliable, scalable thermal management that provides rapid insights to operate at full potential,” said My Truong, CTO, ZutaCore. “Our new End-of-Row CDU family gives operators the control, intelligence, and reliability required to scale sustainably. By integrating advanced cooling physics with modern RESTful APIs for remote monitoring and management, we’re enabling data centers to unlock new performance levels without compromising uptime or efficiency.” 

Designed for a wide variety of availability needs, hot-swappable components ensuring continuous operation and minimal downtime. Multiple deployment models allow customers to meet their needs: balanced and cost-effective scale in an industry-standard singular unit or active-standby to address more traditional enterprise design requirements with two complete CDU’s available for the workload. RestFUL API’s ensures secure, encrypted connectivity and real-time visibility across all deployed units, addressing white-space usage patterns and needs.  

ZutaCore’s latest innovation is already resonating with industry leaders. EGIL Wings, a company driving the development of sustainable AI data center infrastructure, will integrate ZutaCore’s End-of-Row CDUs into its 15MW AI Vault platform. 

“ZutaCore’s End-of-Row CDUs are exactly the kind of innovation needed to meet the energy and thermal challenges of AI-scale compute,” said Leland Sparks, President, EGIL Wings. “By pairing ZutaCore’s waterless cooling with our sustainable power systems, we can deliver data centers that are faster to deploy, more energy-efficient, and ready for the global scale of AI.” 

ZutaCore’s HyperCool technology is built on a robust IP portfolio spanning chip-to-system two-phase liquid cooling architectures. Proven across more than 40 global deployments over the past four years—with customers including Equinix, SoftBank, and the University of Münster —ZutaCore HyperCool delivers unparalleled performance, efficiency, and scalability across diverse geographies. With over 100 employees across the U.S., Europe, Israel, Taiwan, and India, ZutaCore continues to grow its ecosystem through strategic partnerships with industry leaders such as Mitsubishi Heavy Industries (MHI) and Carrier. Through its collaboration with ASRock Rack, ZutaCore is advancing sustainable innovation in AI data center platforms, including the NVIDIA HGX B300 server, a pre-assembled, factory-warranted system featuring ZutaCore’s waterless, direct-to-chip cooling technology for next-generation AI workloads. 

About ZutaCore 

Founded in 2016, ZutaCore is redefining sustainable cooling with ZutaCore® HyperCool®, a waterless, direct-to-chip liquid cooling technology built for the most demanding AI workloads. Capable of cooling the industry’s hottest processors, HyperCool empowers data centers to scale more safely, efficiently, and sustainably. Headquartered in Foster City, California, and operating globally, ZutaCore is leading the charge toward net-zero, waterless data centers. 

Learn more about  ZutaCore® HyperCool® and its impact on AI data centers at zutacore.com and read our latest customer stories at zutacore.com/customer-stories. 

 

ZutaCore Press Contact 

Alison Deane                                                                    
Vice President, Marketing                                                
marketing@zutacore.com 

 

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