All hands are on deck for next week’s Dell Technologies World where ZutaCore® will be showcasing an expanded ecosystem that aims to bring sustainable AI to the masses with its waterless, direct-to-chip liquid cooling technology. Leading up to the show, we made several key announcements:
UNICOM Engineering Partnership Brings Sustainable AI to the Masses
UNICOM Engineering provides server-based application platforms and lifecycle support services for software technology developers, data center infrastructure, OEMs, and enterprises worldwide, underscoring this collaboration's global reach and impact. This partnership marks a crucial move in embedding ZutaCore’s HyperCool® into leading servers worldwide, starting with Dell Technologies XE9680 with NVIDIA H100 and H200 GPUs, ensuring global enterprise support and warranties for data centers at scale.
As Rusty Cone, General Manager at UNICOM stated, “Leveraging UNICOM Engineering’s technical expertise, global footprint, and established relationships with the industry’s leading silicon manufacturers and server OEMs, specifically Dell Technologies, data center clients and partners can be assured the highest standards are being met for the integration of the ZutaCore HyperCool technology, This, along with a full fledge of warranty and uplifted services, globally, will enable the realization of a sustainable AI infrastructure capable of supporting a wide range of applications that require even the most demanding workloads and processing power.”
A Single, Monolithic Cold Plate Can Cool 2,800 Watts and Beyond
At next week’s Dell Technologies World, ZutaCore will be showcasing the industry’s first waterless cold plates to support the GB200 Grace Blackwell Superchip, featuring an unprecedented ability to cool 120kW of rack power with little or no modifications to current real estate, power, or cooling systems.
With over 400 billion transistors, the Grace Blackwell superchip features two NVIDIA Blackwell GPUs, an NVIDIA Grace CPU, and two I/O chips. A single ZutaCore HyperCool waterless cold plate will sit directly on top of this superchip, taking up very little space while providing significant cooling capabilities. In a typical GB200 2RU (featuring two 2 x NVIDIA GB200 modules of 2,800 watts each) a single, monolithic ZutaCore cold plate can deliver 2,800 watts of cooling. The monolithic cold plate ensures a simple design with only one input and one output, which reduces the potential points of failure to deliver a higher level of reliability. The module is also equipped with OCP-compliant blind mate connectors that support 5,600kW.
According to Mark Nossokoff, Research Director for Hyperion Research, “The next generation of high-performance GPUs, such as NVIDIA’s GB200, that are required to meet the demanding needs of AI model training will generate a significant amount of heat, making efficient cooling solutions crucial for optimal system performance and sustainable operation. Innovative cooling solutions such as ZutaCore’s HyperCool waterless, direct-to-chip liquid cooling approach that eliminates the need for water in the cooling process, aim to optimize performance, maximize energy efficiency, and reduce operation costs associated with running the most advanced AI computing systems.”
Come See us at Dell Technologies World 2024
Sign up to meet with us at booth #321 and receive a show exclusive ZUAI t-shirt (only available at DTW24).