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Direct-to-Chip Liquid Cooling at BISCI 2024
ZutaCore and Chatsworth Products (CPI) take the Stage at BISCI 2024 At last week’s Building Industry Consulting Service International (BICSI) Winter...
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Arnon Cohen : Aug 27, 2024 12:26:31 PM
With the massive build out of AI factories and HPC data centers, liquid cooling has suddenly become one of the most critical requirements of the decade as hyperscalers scramble to control their heat and footprint while still contributing to global sustainability goals. There is no question that this technology is being adopted at an unprecedented rate, but there are still a lot of questions in the market over what the differences are between two-phase direct-to-chip liquid cooling and immersion liquid cooling and they are not the same!
At a high level, both types of cooling use dielectric liquid. However, with Immersion liquid cooling, all the servers and other components are completely submerged in dielectric liquid in big heavy tanks. In contrast, the two-phase direct-to-chip process brings only a small amount of dielectric liquid to a cold plate that is placed directly on top of the high heat flux source such as CPUs and GPUs.
As an example, the below picture shows ZutaCore cold plates sitting on NVIDIA H100 GPUs. As you can see, the dielectric liquid never touches the equipment, since it flows in a closed loop system. If this were showing immersion cooling, the entire rack would be completely submerged in the liquid. To put in perspective how much fluid each solution uses….a 100kW rack using two phase direct-to-chip technology uses less than 4 gallons of dielectric fluid, compared to immersion cooling that needs over 100 gallons per rack.
In contrast to two-phase direct-to-chip cooling, immersion cooling requires significant data center infrastructure investment because large and heavy tanks filled with liquid are now needed to hold the equipment. There are several disadvantages of this approach:
The Two-Phase, Direct to Chip Liquid Cooling Advantage
In contrast to immersion cooling, the two-phase direct-to-chip approach such as ZutaCoreÒ HyperCoolÒ uses a highly efficient, two-phase boiling and condensation process moving large amounts of heat off the processors and away from servers. This technology is scalable and can be deployed in new or retrofitted data centers, with an ability to cool 2,800 watts and beyond. Other advantages include:
With dozens of HyperCool deployments in production, ZutaCore has emerged as the clear leader of two-phase, direct-to-chip liquid cooling technology. To learn more, download the eBook.
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