Densification of the Data Center: Cooling for High Density Computing

The rising demand for high-performance computing (HPC), AI, IoT, and 5G technologies has become a major challenge as chips grow ever-hotter and data centers spiral in complexity. With processors now hitting wattages beyond 2800W, densification — or maximizing the output from existing infrastructure — is key to supporting these innovations. However, densifying a data center requires advanced cooling solutions that can manage intense heat loads without sacrificing safety or sustainability.

The HyperCool^® system from ZutaCore^® is the answer, providing direct-to-chip, waterless liquid cooling that enables data centers to get more out of their current infrastructure while reducing costs and environmental impact. Unlike traditional air-based cooling or water-dependent systems, HyperCool is engineered for high density environments, offering unmatched reliability and energy efficiency. Here’s how HyperCool is paving the way for data center densification.

Why Densification Requires a New Approach to Cooling

As data centers densify, they need to cool increasingly dense silicon, racks, and server rooms, particularly in light of the rising wattage of modern GPUs used for AI and machine learning. Higher compute densities generate more heat, and traditional cooling methods like air or water-based systems simply can’t keep up. In fact, air-based cooling systems often lead to hot spots, uneven thermal management, and wasted floor space, while water-based systems present leakage risks and extensive maintenance needs.

With HyperCool, ZutaCore removes these limitations, allowing data centers to achieve up to >250kW per rack and cooling capacity for processors up to 2800W. HyperCool’s waterless, two-phase heat transfer fluid extracts heat directly from the chip while eliminating the dangers and inefficiencies associated with water. This innovation allows data centers to operate with increased density and reduced footprint, handling workloads efficiently and with minimal environmental impact.

The HyperCool® Advantage: Efficient, Sustainable, and Future-Ready

The HyperCool system addresses the core challenges of densifying data centers with a self-contained, closed-loop system that uses a non-conductive, heat transfer fluid. Here’s a closer look at the advantages of HyperCool’s technology:

1. Increased Performance and Reliability
   • Direct-to-Chip, Waterless Cooling: By applying a waterless, two-phase liquid directly to the chip, HyperCool reduces the risk of leaks, corrosion, and water-related incidents, ensuring optimal performance and protection for critical IT infrastructure.
   • Compute Density Beyond >250kW Per Rack: With a low-profile design that fits within 1U dimensions, HyperCool triples the processing capacity in high-density computing environments, maximizing output from each server.
   • Future-Ready Capabilities: Capable of supporting processors beyond 2800W, HyperCool is designed to accommodate the next generation of AI and HPC workloads.
2. Zero Emissions Data Centers
   • Significant Energy Savings: HyperCool uses up to 82% less energy compared to traditional air-cooling systems, dramatically lowering data centers' power consumption.
   • Heat Reuse Without Heat Pumps: This system enables 100% heat recovery, allowing data centers to redirect the reclaimed heat to other areas like nearby office spaces or internal heating, further reducing waste and utility costs.
   • Reduced Environmental Footprint: Operating with zero emissions and requiring no water, HyperCool supports increased compute density while conserving both water and land resources.
3. OPEX & CAPEX Savings
   
   • Fast Return on Investment: By reducing operational and capital expenses, HyperCool can deliver an ROI in under two years, with immediate benefits for new AI data centers.
   • No Need for Chillers or CRAC Systems: By eliminating chillers and CRAC requirements, HyperCool drastically cuts down on upfront CAPEX, freeing up budgets for further technology investments
   • Cost Savings in High-Capacity Data Centers: A 2MW data center can potentially save up to $1 million annually using HyperCool, enhancing profitability while supporting sustainable growth.

Easy Integration for New Builds and Retrofits

HyperCool is designed for both new installations and retrofits, allowing data centers to enhance their capabilities without extensive reconfiguration. The system’s modular architecture allows it to integrate smoothly with existing servers and racks, requiring minimal space and operational downtime. With compact cold plates and heat rejection units, HyperCool optimizes space use while enabling future scalability. 

Furthermore, HyperCool’s Software Defined Cooling (SDC) solution automates monitoring and control, optimizing system performance and ensuring each component runs at peak efficiency. SDC’s real-time data analytics provide insights on power consumption, CPU loads, and temperature management, helping operators manage performance in a rapidly evolving landscape.

Densification for the Future of AI, IoT, and Beyond

HyperCool is driving the next generation of data center cooling solutions that supports AI and HPC applications while simultaneously helping data centers achieve higher levels of sustainability. The liquid cooling system's small-but-mighty footprint is conducive to the design of new, higher-density processors, servers, and racks.

By maximizing compute density, conserving resources, and cutting costs, AI factory and data center operators can equip their facilities with a future-ready solution that aligns with the growing demand for efficiency and eco-friendly practices.

Connect with the ZutaCore team to explore how HyperCool can transform your data center into a high-density, high-efficiency powerhouse—one that’s built to meet the demands of AI, IoT, and tomorrow’s data-driven world.