ZutaCore/Valeo Present New Solution For Cooling Data Centers

ZutaCore/Valeo Present New Solution For Cooling Data Centers

At CES in January 2023, Valeo and ZutaCore® announced an agreement to research and bring to market a new method of liquid cooling for the data centers. At Dell Technologies World, they are announcing the Zutacore® HyperCool® solution equipped with Valeo’s new 3U Water Heat Reuse Unit. It offers optimized reliability and performance of the servers thanks to a very high performance two-phase, dielectric liquid cooling of the chips for edge computing data centers.

Rittal and ZutaCore at the 2021 OCP Global Summit

Rittal and ZutaCore at the 2021 OCP Global Summit

The digital transformation is challenging the data center industry. Applications based on artificial intelligence (AI) or machine learning are...

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Asrock Rack ZutaCore at 2022 OCP Global Summit

Asrock Rack ZutaCore at 2022 OCP Global Summit

Data industry sustainability has risen to the top for decision makers, calling for significant technology transition. The global need to move to Net...

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ZutaCore/Equinix to Test Sustainable Data Center Innovations

ZutaCore/Equinix to Test Sustainable Data Center Innovations

Company Opens Co-Innovation Facility in Washington, D.C. as Part of Its Innovation and Sustainability Strategy

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