ZutaCore/Valeo Present New Solution For Cooling Data Centers

ZutaCore/Valeo Present New Solution For Cooling Data Centers

At CES in January 2023, Valeo and ZutaCore® announced an agreement to research and bring to market a new method of liquid cooling for the data centers. At Dell Technologies World, they are announcing the Zutacore® HyperCool® solution equipped with Valeo’s new 3U Water Heat Reuse Unit. It offers optimized reliability and performance of the servers thanks to a very high performance two-phase, dielectric liquid cooling of the chips for edge computing data centers.

Valeo Enters Commercial Production with Heat Reuse Units (HRU) compatible with ZutaCore's Two-Phase Direct-to-Chip Liquid Cooling

Valeo Enters Commercial Production with Heat Reuse Units (HRU) compatible with ZutaCore's Two-Phase Direct-to-Chip Liquid Cooling

Delivering 60kW of cooling power in a very small 3RU size, the Valeo HRUs integrated into ZutaCore’s HyperCool system provide a new era of...

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ZutaCore and Valeo Announce 4-Year Commercial Agreement

ZutaCore and Valeo Announce 4-Year Commercial Agreement

Valeo and ZutaCore®are excited to announce at the Valeo press conference at CES,a 4-yearcommercial agreement to address the growing demand for...

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Pegatron Certifies ZutaCore's Two-Phase, Direct-to-Chip Liquid Cooling up to 2,800 Watts

Pegatron Certifies ZutaCore's Two-Phase, Direct-to-Chip Liquid Cooling up to 2,800 Watts

ZutaCore®, a leading provider of direct-to-chip, waterless liquid cooling solutions, today announced that its HyperCool® technology has achieved...

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