Foster City, CA - June 2nd, 2026 - ZutaCore®, a leader in waterless, direct-to-chip, two-phase liquid cooling, today announced its $100 million Series C funding round. The round includes investment from Mitsubishi Electric, Carrier Ventures, and Samsung Electronics (via its CVC arm, Samsung Ventures), alongside additional investors.
The funding supports global commercialization expansion as ZutaCore scales to meet rapidly growing bookings and deployments driven by surging demand for AI and high-performance computing (HPC) infrastructure. It will also advance, R&D to address the evolving thermal requirements of next-generation chip architectures - driving innovation in in-package thermal management enabling seamless two-phase integration with existing air and single-phase systems, and supporting megawatt-class deployments. ZutaCore’s waterless two-phase cooling platform is designed to support next-generation AI and HPC processors exceeding 4,000 watts, enabling higher compute density and sustained performance at scale
This milestone reflects strong market confidence in ZutaCore’s technology and vision, fueling continued global expansion, product innovation, and large-scale customer adoption.
ZutaCore has achieved more than 75 deployments worldwide, across the Americas, Europe and Asia, demonstrating the growing adoption of two-phase, direct-to-chip liquid cooling in production environments.
The company continues to collaborate with leading global partners to deliver advanced thermal management solutions, helping remove critical roadblocks in next-generation chip roadmaps and accelerate time to market.
Scaling Leadership to Match Market Demand
To support its accelerating global momentum, ZutaCore is expanding its leadership team and international presence—recruiting top talent and building the infrastructure needed to enable worldwide deployments, strategic partnerships, and deep technical collaborations with leading industry players. To support this growth, ZutaCore has expanded its executive team with four key strategic hires:
Yaniv Reinhold, Chief Financial Officer – brings more than 25 years of experience in global finance and scaling high-growth technology companies, including leadership roles at Gilat Satellite Networks, Sony Semiconductor Israel and Coro Cybersecurity.
Sarah Warshavsky Oberman, Chief People Officer – brings extensive experience in organizational transformation, talent strategy, and workforce development across global technology companies, including leadership roles at Coro Cybersecurity, Allot, OptimalPlus, National Instruments, and Micron.
Yoni Nir, Chief Research and Development Officer – a deep-tech engineering leader with more than 20 years of experience, including senior roles at HP. He brings expertise in building high-performing teams and delivering complex systems at scale.
Sharon Shafran, Chief Operating Officer – a seasoned operator with over 20 years of experience scaling global technology companies across AI/ML, data infrastructure, and enterprise systems. He has led large-scale deployments and global operations across startups and multinational organizations.
These leaders join Erez Freibach, Chairman and CEO, Brian Lillie, President and Chief Revenue Officer, My Truong, Chief Product and Technology Officer, and Susan Mor, Chief of Staff - forming a seasoned leadership team focused on scaling execution and delivering next-generation cooling infrastructure to hyperscalers, neoclouds, data center operators, and other demanding enterprise compute environments.
A Year Of Landmark Innovations and Accelerating Growth
With AI workloads surging and data center power densities climbing into the multi-megawatt range, operators require scalable, energy-efficient solutions that can handle extreme heat loads at scale. Waterless two-phase, direct-to-chip liquid cooling has become a critical enabler of this shift, positioning ZutaCore at the forefront of this transformation.
To support this transition, ZutaCore established a 2MW End-of-Row emulation platform at its facility in Israel. This platform replicates real-world thermal and facility interactions without relying on production IT equipment, enabling validation of performance, stability, and integration requirements at multi-megawatt scale while significantly reducing deployment risk for customers.
In parallel, ZutaCore continues to introduce highly innovative solutions, including its OmniTherm™ cold plate, which enables waterless two-phase cooling for the NVIDIA RTX PRO™ 6000 Blackwell Server Edition in a single-slot PCIe form factor, supporting full-power operation in standard enterprise and AI cloud server environments.
ZutaCore continues to advance its platform to meet the rapidly evolving requirements of AI-driven data centers.
Erez Freibach, Chairman and CEO of ZutaCore, said: "$100M of funding reflects strong validation from leading global partners and growing demand for our technology. AI is fundamentally reshaping data center infrastructure, and traditional approaches are no longer sufficient. With our expanding leadership team and continued innovation, we are well positioned to support the next generation of high-performance, sustainable data centers.”
Goldman Sachs & Co. LLC is serving as exclusive placement agent to ZutaCore in connection with its Series C capital raise.
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About ZutaCore
ZutaCore’s waterless two-phase direct-to-chip liquid cooling delivers unrivaled performance, eliminates water risk, and cuts energy use in half. Proven at scale in the world’s most demanding data centers, it is the clear choice for AI, cloud, and enterprise leaders. Learn more at www.zutacore.com.
Learn more about ZutaCore® HyperCool® and its impact on AI data centers at zutacore.com and read our latest customer stories at zutacore.com/customer-stories.
ZutaCore Press Contact
Alison Deane
Vice President, Marketing
marketing@zutacore.com