ZutaCore® and Valeo has announced a significant milestone in their joint effort to drive the development of more energy-efficient and environmentally friendly data centers for AI factories. Valeo’s Heat Reuse Units (HRUs) and manifolds, designed to integrate with ZutaCore’s HyperCool® waterless direct-to-chip liquid cooling solution, are now in commercial production, paving the way towards AI factories that can support high-density racks economically and sustainably. This system, including a real-time pool-boiling demonstration on NVIDIA GPUs, will be featured at the 2025 Consumer Electronics Show (CES) in the Valeo booth # CP-709LVCC, Central Plaza.